Technology & Architecture

The Core Computing Engine

Processor Class: We utilize a Hexa Core Edge SoC (System-on-Chip) integrating a dedicated 5 TOPS NPU Neural Processing Unit. This powerful on-chip acceleration ensures all heavy AI tasks are executed locally, maximizing speed and data privacy.

Operating System AroOS: Our custom-built, secured Embedded Linux distribution AroOS is engineered for single purpose Appliance Mode. The OS stack provides the necessary kernel environment for our C/Python middleware while minimizing the software attack surface.

Primary Trust Layer (3D Biometrics):
We utilize an integrated 3D Depth Sensing Unit (Active IR Depth) to acquire precise facial depth maps. This on-device process verifies biological presence, instantly defeating photos and videos.

Proactive Ranging & Tamper Detection:
The platform fuses data from two non-visual rangefinders — a 1000 FPS LiDAR Engine (for precise distance verification) and 24 GHz mmWave Radar (for micro-motion triggering). This fusion ensures the AI stack activates only when a target is optimally positioned.

Encrypted OSDP Bridge:
We implement the OSDP v2.2 Secure Channel protocol using a dedicated RS-485 interface on the SBC’s UART bus. This C/Python middleware manages AES-128 encryption of all credential traffic.

Digital I²S Audio Interface:
Audio feedback is provided via a digital Class-D amplifier that connects directly to the system’s I²S bus. This design guarantees signal integrity and eliminates noise issues associated with analog jacks.

Scalable Manufacturing Path:
Our platform is engineered for mass production through a custom carrier board architecture (designed in KiCad), integrating all discrete components into a single, high-quality PCB unit — fully optimized for scaling.

Codebase:
All application logic is built around Python (PyQt HMI, multi-threading) and C/C++ fundamentals for performance-critical I/O tasks.

Manufacturing Path:
The platform is engineered for mass production through a custom carrier board architecture that integrates all discrete components into a single, compact, and manufacturable unit. This design demonstrates scalability for OEM partnerships and ensures lowest production cost at volume.